Huiying Ding
4Patents
1h-index
4Co-inventors
30Inventor score
Filing activity: Feb 7, 2020 → Sep 19, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11450534B2 | Packaging process for side-wall plating with a conductive film | Electricity | 2 | Active |
| US11393699B2 | Packaging process for plating with selective molding | Electricity | 0 | Active |
| US11876003B2 | Semiconductor package and packaging process for side-wall plating with a conductive film | Electricity | 0 | Active |
| US11764075B2 | Package assembly for plating with selective molding | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.