Hyouk Lee
4Patents
1h-index
8Co-inventors
37Inventor score
Filing activity: Dec 23, 1998 → Aug 1, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10474192B2 | Wearable smart device having flexible semiconductor package mounted on a band | Electricity | 19 | Active |
| USD419976S | Monitor | General | 1 | Expired |
| US9559080B2 | Integrated circuit device packages and methods for manufacturing integrated circuit device packages | Electricity | 1 | Active |
| US10522522B2 | Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.