Inventor · Hsinchu, TW

I-Ching Chen

13Patents
2h-index
25Co-inventors
54Inventor score

Filing activity: Dec 9, 2004 → Mar 4, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US10566519B2 Method for forming a flat bottom electrode via (BEVA) top surface for memory Electricity 6 Active
US9754955B2 High-K-last manufacturing process for embedded memory with metal-oxide-nitride-oxide-silicon (MONOS) memory cells Electricity 2 Active
US12164787B2 Microcontroller and memory control method thereof Emerging Cross-Sectional Technologies 0 Active
US12098412B2 Roseburia hominis HGM001 isolate and use thereof Chemistry; Metallurgy 0 Active
US12405656B2 Power control method for microcontroller unit and power control system using the same Emerging Cross-Sectional Technologies 0 Active
US9842850B2 High-K-last manufacturing process for embedded memory with silicon-oxide-nitride-oxide-silicon (SONOS) memory cells Electricity 0 Active
US7534602B2 Promoters and usage thereof Chemistry; Metallurgy 0 Expired
US11751485B2 Flat bottom electrode via (BEVA) top surface for memory Electricity 0 Active
US10158072B1 Step height reduction of memory element Electricity 0 Active
US10763426B2 Method for forming a flat bottom electrode via (BEVA) top surface for memory Electricity 0 Active
US11201281B2 Method for forming a flat bottom electrode via (BEVA) top surface for memory Electricity 0 Active
US8542358B2 Optical calibration and testing device for machine tools Physics 0 Active
US11844286B2 Flat bottom electrode via (BEVA) top surface for memory Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.