Il-Heung Choi
8Patents
4h-index
7Co-inventors
42Inventor score
Filing activity: Mar 6, 1998 → Dec 27, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7453159B2 | Semiconductor chip having bond pads | Electricity | 9 | Active |
| US6642627B2 | Semiconductor chip having bond pads and multi-chip package | Electricity | 6 | Expired |
| US7576440B2 | Semiconductor chip having bond pads and multi-chip package | Electricity | 5 | Active |
| US6183589A | Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leads | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7541682B2 | Semiconductor chip having bond pads | Electricity | 3 | Active |
| US7547977B2 | Semiconductor chip having bond pads | Electricity | 2 | Active |
| US7148578B2 | Semiconductor multi-chip package | Electricity | 1 | Expired |
| US7825523B2 | Semiconductor chip having bond pads | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.