Jack Chen
10Patents
3h-index
11Co-inventors
49Inventor score
Filing activity: Sep 9, 2004 → Dec 28, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD645421S1 | LED base | General | 9 | Expired |
| US8555492B2 | Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach | Emerging Cross-Sectional Technologies | 6 | Active |
| US8384222B2 | Semiconductor device and manufacturing method thereof | Electricity | 3 | Active |
| US8910169B2 | Methods and systems to perform a computer task in a reduced power consumption state | Physics | 2 | Active |
| US7279268B2 | Conductive lithographic polymer and method of making devices using same | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7968448B2 | Semiconductor device and manufacturing method thereof | Electricity | 1 | Active |
| US7923747B2 | Wafer level LED package structure and method for making the same | Electricity | 0 | Active |
| US8263876B2 | Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US7700246B2 | Conductive lithographic polymer and method of making devices using same | Emerging Cross-Sectional Technologies | 0 | Active |
| US8053885B2 | Wafer level vertical diode package structure and method for making the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.