Jacob Herschmann
4Patents
2h-index
8Co-inventors
37Inventor score
Filing activity: May 21, 2008 → Sep 1, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7888951B2 | Integrated unit for electrical/reliability testing with improved thermal control | Physics | 6 | Active |
| US7598760B1 | High temperature ceramic die package and DUT board socket | Electricity | 2 | Active |
| US11175309B2 | Semi-automatic prober | Physics | 1 | Active |
| US12135335B2 | Semi-automatic prober | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.