Jaecheon Lee
2Patents
1h-index
4Co-inventors
27Inventor score
Filing activity: Jan 18, 2019 → May 28, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10957654B2 | Semiconductor package and method of manufacturing the same | Electricity | 3 | Active |
| US11062990B2 | Semiconductor package of using insulating frame | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.