James Drumm
4Patents
4h-index
10Co-inventors
47Inventor score
Filing activity: Aug 9, 1988 → Dec 3, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5025306A | Assembly of semiconductor chips | Electricity | 131 | Expired |
| US5327327A | Three dimensional assembly of integrated circuit chips | Electricity | 71 | Expired |
| US5646068A | Solder bump transfer for microelectronics packaging and assembly | Electricity | 24 | Expired |
| US6267894A | Method for efficient filtration of chemical baths | Emerging Cross-Sectional Technologies | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.