James Fiore
2Patents
2h-index
3Co-inventors
27Inventor score
Filing activity: Jul 26, 1996 → Jul 17, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6204074A | Chip design process for wire bond and flip-chip package | Electricity | 76 | Expired |
| US5844317A | Consolidated chip design for wire bond and flip-chip package technologies | Electricity | 69 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.