Jason Layton
7Patents
6h-index
12Co-inventors
56Inventor score
Filing activity: Sep 4, 1997 → Jan 29, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6121061A | Method of processing wafers with low mass support | Chemistry; Metallurgy | 474 | Expired |
| US6113702A | Wafer support system | Electricity | 52 | Expired |
| US6343183B1 | Wafer support system | Electricity | 49 | Expired |
| US6491757B2 | Wafer support system | Electricity | 19 | Expired |
| US6454866B1 | Wafer support system | Electricity | 18 | Expired |
| US6284048A | Method of processing wafers with low mass support | Chemistry; Metallurgy | 16 | Expired |
| US7655093B2 | Wafer support system | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.