Wafer support system

US6491757B2 · kind B2 · utility

Assignee

• ASM America, Inc. · US

Inventors

• Michael Halpin · Scottsdale, US
• Mark Hawkins · Chillicothe, US
• Derrick W. Foster · San Jose, US
• Robert Vyne · Chandler, US
• John F. Wengert · Jacksonville, US
• Cornelius A. van der Jeugd · Heverlee, BE
• Loren Jacobs · Austin, US
• Frank B. M. Van Bilsen · Phoenix, US
• Matthew G. Goodman · Chandler, US
• Hartmann Glenn · Phoenix, US
• Jason Layton · Chandler, US

Key dates

• Filing date: Aug 17, 2001
• Grant date: Dec 10, 2002
• Expiry date: Aug 17, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An apparatus for processing a substrate comprises a susceptor for supporting the substrate, an upper heat source spaced above the susceptor, a lower heat source spaced below the susceptor, and a controller. The controller provides power to the heat sources at a selected ratio between the sources. The controller is configured to vary the ratio during a high temperature processing cycle of a substrate to thereby vary the ratio of the heat provided by the heat sources during the cycle.