Jayeon LEE
4Patents
1h-index
7Co-inventors
30Inventor score
Filing activity: Oct 29, 2020 → Jan 24, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11923343B2 | Semiconductor package and method of fabricating the same | Electricity | 1 | Active |
| US11538792B2 | Semiconductor package and method of fabricating the same | Electricity | 0 | Active |
| US11791282B2 | Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same | Electricity | 0 | Active |
| US12362328B2 | Semiconductor package and method of fabricating the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.