Jen-Yu Chen
6Patents
2h-index
15Co-inventors
40Inventor score
Filing activity: Dec 13, 2011 → Oct 31, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9685402B2 | Semiconductor device and method of forming recesses in conductive layer to detect continuity for interconnect between semiconductor die and substrate | Electricity | 3 | Active |
| US8741764B2 | Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate | Electricity | 2 | Active |
| US9478513B2 | Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate | Electricity | 2 | Active |
| US10213758B2 | Polymer and dispersion | Chemistry; Metallurgy | 1 | Active |
| US9627286B1 | Package structure | Electricity | 0 | Active |
| US9976898B2 | Optical sensing module with multi-directional optical sensing function | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.