Jia Wang
6Patents
1h-index
12Co-inventors
44Inventor score
Filing activity: Aug 5, 2013 → Oct 18, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10679854B2 | Wafer bonding method and structure thereof | Electricity | 2 | Active |
| US9258024B2 | SIM card connector and mobile terminal | Electricity | 0 | Active |
| US11825837B2 | Dispenser and method of use thereof | Performing Operations; Transporting | 0 | Active |
| US11342185B2 | Wafer bonding method and structure thereof | Electricity | 0 | Active |
| US10872327B2 | Mobile payment systems and mobile payment methods thereof | Physics | 0 | Active |
| US12219956B2 | Dispenser and method of use thereof | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.