JIAN-DE LEU
2Patents
1h-index
4Co-inventors
27Inventor score
Filing activity: Jan 26, 2021 → Feb 2, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11355356B1 | Manufacturing method of semiconductor package comprising heat spreader | Electricity | 1 | Active |
| US11462454B2 | Semiconductor package comprising heat spreader and manufacturing method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.