Manufacturing method of semiconductor package comprising heat spreader
US11355356B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2021 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Feb 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The method of manufacturing a semiconductor package of the present disclosure includes: providing a redistribution layer having opposing first surface and second surface; disposing a die on the first surface of the redistribution layer and electrically connecting the die to the redistribution layer; forming a mask on the second surface of the redistribution layer; performing a chemical or plasma etching process on the second surface of the redistribution layer to expose the conductive traces in the redistribution layer; removing the mask; and forming a plurality of conductive bumps on the second surface of the redistribution layer and electrically connecting the conductive bumps to the exposed conductive traces in the redistribution layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.