Semiconductor package comprising heat spreader and manufacturing method thereof
US11462454B2 · kind B2 · utility
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1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2021 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Jan 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a semiconductor package. The semiconductor package includes a redistribution layer, a die, a heat spreader, a thermal interface material and a molding layer. The die is disposed on the redistribution layer. The heat spreader is disposed on the die. The thermal interface material is applied between the heat spreader and the die. The molding layer is formed on the redistribution layer to enclose the die. The present disclosure further provides a method of manufacturing the above semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.