John A. Forthun
8Patents
7h-index
8Co-inventors
52Inventor score
Filing activity: Apr 13, 1995 → Oct 26, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5612570A | Chip stack and method of making same | Electricity | 192 | Expired |
| US6262895A | Stackable chip package with flex carrier | Electricity | 165 | Expired |
| US5869353A | Modular panel stacking process | Electricity | 135 | Expired |
| US6473308B2 | Stackable chip package with flex carrier | Electricity | 98 | Expired |
| US6627984B2 | Chip stack with differing chip package types | Electricity | 83 | Expired |
| US6660561B2 | Method of assembling a stackable integrated circuit chip | Electricity | 68 | Expired |
| US6908792B2 | Chip stack with differing chip package types | Electricity | 57 | Expired |
| USRE41039E1 | Stackable chip package with flex carrier | General | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.