John Conner
3Patents
2h-index
3Co-inventors
33Inventor score
Filing activity: Dec 23, 2003 → Mar 4, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7358444B2 | Folded substrate with interposer package for integrated circuit devices | Emerging Cross-Sectional Technologies | 17 | Expired |
| US7375978B2 | Method and apparatus for trace shielding and routing on a substrate | Electricity | 12 | Expired |
| US7818878B2 | Integrated circuit device mounting with folded substrate and interposer | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.