Integrated circuit device mounting with folded substrate and interposer
US7818878B2 · kind B2 · utility
0Cited by
33References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2008 |
| Grant date | Oct 26, 2010 |
| Priority date | — |
| Expiry date | Aug 8, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.