Folded substrate with interposer package for integrated circuit devices
US7358444B2 · kind B2 · utility
17Cited by
9References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2004 |
| Grant date | Apr 15, 2008 |
| Priority date | — |
| Expiry date | Aug 3, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.