John Floyd Ostrowski
10Patents
4h-index
13Co-inventors
57Inventor score
Filing activity: Feb 9, 1999 → Dec 23, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6167893A | Dynamic chuck for semiconductor wafer or other substrate | Emerging Cross-Sectional Technologies | 52 | Expired |
| US6440291B1 | Controlled induction by use of power supply trigger in electrochemical processing | Chemistry; Metallurgy | 26 | Expired |
| US8753447B2 | Heat shield for heater in semiconductor processing apparatus | Emerging Cross-Sectional Technologies | 8 | Active |
| US10066311B2 | Multi-contact lipseals and associated electroplating methods | Chemistry; Metallurgy | 5 | Active |
| US10208395B2 | Bubble and foam solutions using a completely immersed air-free feedback flow control valve | Chemistry; Metallurgy | 3 | Active |
| US9617652B2 | Bubble and foam solutions using a completely immersed air-free feedback flow control valve | Chemistry; Metallurgy | 3 | Active |
| US11746435B2 | Removing bubbles from plating cells | Chemistry; Metallurgy | 0 | Active |
| US11214887B2 | Removing bubbles from plating cell | Chemistry; Metallurgy | 0 | Active |
| US8346611B2 | Systems and methods for pre-paid futures procurement | Physics | 0 | Active |
| US10655240B2 | Removing bubbles from plating cells | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.