Multi-contact lipseals and associated electroplating methods
US10066311B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2016 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Jul 4, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/005
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed herein are lipseal assemblies for use in an electroplating clamshell for engaging and supplying electrical current to a semiconductor substrate during electroplating, which include an elastomeric lipseal for engaging the semiconductor substrate during electroplating, and wherein upon engagement the elastomeric lipseal forms multiple radially-separated sealing contact surfaces with the substrate which substantially exclude plating solution from a peripheral region of the substrate. Said lipseal assemblies may also include one or more electrical contact elements for supplying electrical current to the semiconductor substrate during electroplating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.