Three-dimensional circuit assembly with composite bonded encapsulation
US11277909B2 · kind B2 · utility
0Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2020 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Aug 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/095
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosure provides a three-dimensional circuit assembly including a printed circuit board comprising a top film surface and a bottom film surface opposite to the top film surface. The three-dimensional circuit assembly may also include a first layer of a composite material bonded or laminated on the top film surface. The three-dimensional circuit assembly may further include a second layer of the composite material bonded or laminated on the bottom film surface of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.