Joseph Anthony Boduch
3Patents
1h-index
4Co-inventors
30Inventor score
Filing activity: Apr 20, 2017 → Jan 22, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10068786B1 | Data structures for semiconductor die packaging | Electricity | 2 | Active |
| US10658211B2 | Data structures for semiconductor die packaging | Electricity | 0 | Active |
| US10955468B2 | Wafer probe resumption of die testing | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.