Patent · US Active

Wafer probe resumption of die testing

US10955468B2 · kind B2 · utility

0Cited by

11References

20Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Joseph Anthony Boduch · Frisco, US
Romano Schmidt · Dachau, DE

Key dates

Filing date	Jan 22, 2019
Grant date	Mar 23, 2021
Priority date	—
Expiry date	May 2, 2039

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/2894
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Wafer test control and methodologies are provided for resuming the probing of a wafer, in connection with random, distributed or statistical wafer probing. The resumption of testing may occur after an interruption of a previous probe of the wafer and removal of the wafer from a testing chuck. Parameter settings are retained in addition to probe results from the previous wafer probe session in order to construct a resume probe map according to applicable probing rules and conditions. Wafer probing may be restarted according to the resume probe map.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.