Joseph Daniel Mis
6Patents
6h-index
4Co-inventors
45Inventor score
Filing activity: Nov 5, 1996 → Apr 5, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5767010A | Solder bump fabrication methods and structure including a titanium barrier layer | Electricity | 166 | Expired |
| US6222279A | Solder bump fabrication methods and structures including a titanium barrier layer | Electricity | 59 | Expired |
| US5892179A | Solder bumps and structures for integrated redistribution routing conductors | Emerging Cross-Sectional Technologies | 57 | Expired |
| US5902686A | Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures | Emerging Cross-Sectional Technologies | 55 | Expired |
| US6329608A | Key-shaped solder bumps and under bump metallurgy | Emerging Cross-Sectional Technologies | 42 | Expired |
| US6389691B1 | Methods for forming integrated redistribution routing conductors and solder bumps | Emerging Cross-Sectional Technologies | 33 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.