Jun Young Oh
8Patents
1h-index
14Co-inventors
37Inventor score
Filing activity: Mar 19, 2019 → Feb 27, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11107769B2 | Semiconductor package and a method of fabricating the same | Electricity | 1 | Active |
| US11069588B2 | Semiconductor package and method of manufacturing the same | Electricity | 1 | Active |
| US11955359B2 | Magazine supporting equipment and semiconductor manufacturing apparatus including the same | Electricity | 0 | Active |
| US11562965B2 | Semiconductor package | Electricity | 0 | Active |
| US11699626B2 | Semiconductor package and method of manufacturing the same | Electricity | 0 | Active |
| US11538801B2 | Semiconductor package | Electricity | 0 | Active |
| US11996365B2 | Semiconductor package and a method of fabricating the same | Electricity | 0 | Active |
| US11610845B2 | Semiconductor package and a method of fabricating the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.