Laminating device and method for fabricating semiconductor package using the same
US10748855B2 · kind B2 · utility
1Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2018 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Aug 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a semiconductor package using a laminating device is provided. The method includes placing a substrate on a substrate stand; providing a pressurizing unit which is expandable and includes a convex surface facing an upper surface of the substrate stand, on the substrate stand; injecting air into the pressurizing unit using a plate which is connected to the pressurizing unit; and supplying a film by a film supply unit which supplies the film between the substrate stand and the pressurizing unit, wherein the pressurizing unit attaches the film onto the substrate, while expanding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.