Keisuke Kushida
4Patents
0h-index
7Co-inventors
24Inventor score
Filing activity: Dec 7, 2016 → Dec 2, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12258468B2 | Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package | Electricity | 0 | Active |
| US11136454B2 | Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board | Chemistry; Metallurgy | 0 | Active |
| US10940674B2 | Resin varnish, prepreg, laminate, and printed wiring board | Chemistry; Metallurgy | 0 | Active |
| US11691389B2 | Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.