Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition
US11691389B2 · kind B2 · utility
0Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2020 |
| Grant date | Jul 4, 2023 |
| Priority date | — |
| Expiry date | Oct 12, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2201/56
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.