Resin varnish, prepreg, laminate, and printed wiring board
US10940674B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2016 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Dec 7, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2363/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a resin varnish, a prepreg, a laminate and a printed wiring board, using a thermosetting resin composition having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature and low thermal expansion and excellent in moldability and platability. Specifically, the resin varnish contains (A) a maleimide compound, (B) an epoxy resin, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (G) an organic solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.