Lead frame and semiconductor device employing the same with improved arrangement of supporting leads for securing the semiconductor supporting member
US4301464A · kind A · utility
201Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 5, 1979 |
| Grant date | Nov 17, 1981 |
| Priority date | — |
| Expiry date | Jul 5, 1999 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to a lead frame which is applied to a resin-molded semiconductor device. According to the lead frame of this invention, a quadrangular tab for supporting a semiconductor pellet is supported by four tab leads which extend along diagonal lines of the tab.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.