Ken MacWilliams
2Patents
2h-index
9Co-inventors
27Inventor score
Filing activity: May 25, 2004 → Dec 1, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7049200B2 | Method for forming a low thermal budget spacer | Electricity | 228 | Expired |
| US7166524B2 | Method for ion implanting insulator material to reduce dielectric constant | Electricity | 22 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.