Kevin A. Dore
4Patents
3h-index
8Co-inventors
47Inventor score
Filing activity: Jun 9, 1999 → Oct 9, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6239484A | Underfill of chip-under-chip semiconductor modules | Electricity | 47 | Expired |
| US6291267A | Process for underfilling chip-under-chip semiconductor modules | Electricity | 19 | Expired |
| US8841209B2 | Method for forming coreless flip chip ball grid array (FCBGA) substrates and such substrates formed by the method | Electricity | 3 | Active |
| US11257001B2 | Prediction model enhancement | Physics | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.