Method for forming coreless flip chip ball grid array (FCBGA) substrates and such substrates formed by the method
US8841209B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2011 |
| Grant date | Sep 23, 2014 |
| Priority date | — |
| Expiry date | Nov 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4682
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming coreless flip chip ball grid array (FCBGA) substrates comprising the steps of sequentially depositing a pair of laminates, each having a plurality of insulated metallization layers simultaneously respectively on each side of a temporary carrier substrate, and then removing the temporary carrier to separate the pair of laminates, so that each laminate has an outer ball grid metal pad array, and during the depositing of the pair of laminates on the carrier substrate, further depositing a supporting layer of dielectric material enclosing the metal pad array, wherein said supporting layers of dielectric material provides structural support for each of the laminates after the separation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.