Kimcuc T. Tran
2Patents
2h-index
12Co-inventors
34Inventor score
Filing activity: Sep 29, 1992 → Feb 14, 1994
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5508228A | Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same | Emerging Cross-Sectional Technologies | 118 | Expired |
| US5358604A | Method for producing conductive patterns | Electricity | 25 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.