Method for producing conductive patterns
US5358604A · kind A · utility
25Cited by
14References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1992 |
| Grant date | Oct 25, 1994 |
| Priority date | — |
| Expiry date | Sep 29, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1338
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention provides an apparatus and methods of using the apparatus to transfer conductive patterns onto substrates under conditions of heat and pressure. The apparatus comprises a master mold with a printing surface on which is produced a permanent mirror image of the conductive pattern to be created. This pattern is then coated with a loosely adherent film of conductive metal, such as copper, which is transferred onto a substrate to be printed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.