Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same
US5508228A · kind A · utility
118Cited by
20References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 1994 |
| Grant date | Apr 16, 1996 |
| Priority date | — |
| Expiry date | Feb 14, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/903
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.