Koh Yee Wee
2Patents
2h-index
2Co-inventors
27Inventor score
Filing activity: Feb 24, 2004 → Apr 25, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7052932B2 | Oxygen doped SiC for Cu barrier and etch stop layer in dual damascene fabrication | Emerging Cross-Sectional Technologies | 13 | Expired |
| US7538353B2 | Composite barrier/etch stop layer comprising oxygen doped SiC and SiC for interconnect structures | Emerging Cross-Sectional Technologies | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.