Larry Jacobsen
7Patents
4h-index
5Co-inventors
46Inventor score
Filing activity: Nov 4, 1997 → Dec 27, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7215018B2 | Stacked die BGA or LGA component assembly | Electricity | 63 | Expired |
| US7245021B2 | Micropede stacked die component assembly | Electricity | 38 | Expired |
| US7535109B2 | Die assembly having electrical interconnect | Electricity | 32 | Active |
| US8357999B2 | Assembly having stacked die mounted on substrate | Electricity | 14 | Active |
| US6130113A | Enhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly process | Electricity | 4 | Expired |
| US8729690B2 | Assembly having stacked die mounted on substrate | Electricity | 0 | Active |
| US5973398A | Semiconductor device and fabrication method employing a palladium-plated heat spreader substrate | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.