Enhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly process
US6130113A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1998 |
| Grant date | Oct 10, 2000 |
| Priority date | — |
| Expiry date | Jul 13, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method of making a void free interface between a heatspreader and pressure sensitive adhesive (PSA) by attaching them in an air free environment. The PSA is placed on a pedestal in a vacuum chamber assembly, then the heatspreader is placed on top of the PSA and the chamber is closed. The air is removed by a vacuum means, creating an air free environment. Once the desired vacuum is obtained and the air is removed, pressure is applied to the heatspreader and PSA, joining them together with a void free interface between them. After joining, the vacuum is released and the vacuum chamber assembly is opened so that the heatspreader with PSA attached can be removed. The heatspreader with PSA is now ready for use with a semiconductor package. Additionally, the heatspreader with PSA may be joined to the integrated circuit die of a semiconductor package in an air free environment by the same process (using vacuum and pressure) as describe above.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.