Laurene Yip
2Patents
1h-index
4Co-inventors
30Inventor score
Filing activity: Mar 13, 2008 → Oct 26, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7906857B1 | Molded integrated circuit package and method of forming a molded integrated circuit package | Electricity | 14 | Active |
| US8410604B2 | Lead-free structures in a semiconductor device | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.