Patent · US Active

Molded integrated circuit package and method of forming a molded integrated circuit package

US7906857B1 · kind B1 · utility

14Cited by

23References

18Claims

0Family size

Assignee

XILINX, INC. · US

Inventors

Lan H. Hoang · Fremont, US
Raghunandan Chaware · Mountain View, US
Laurene Yip · San Francisco, US

Key dates

Filing date	Mar 13, 2008
Grant date	Mar 15, 2011
Priority date	—
Expiry date	Jul 31, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A molded integrated circuit package is described. The molded integrated circuit package comprises a substrate having a plurality of contacts on a first surface; a die having a plurality of solder bumps on a first surface, the plurality of solder bumps being coupled to the plurality of contacts on the first surface of the substrate; an adhesive material positioned on a second surface of the die; a lid attached to the adhesive material; and an encapsulant positioned between the lid and the substrate. Methods of forming molded integrated circuit packages are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.