Ligui Zhou
7Patents
6h-index
10Co-inventors
56Inventor score
Filing activity: Jul 21, 1998 → Oct 24, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6121689A | Semiconductor flip-chip package and method for the fabrication thereof | Electricity | 143 | Expired |
| US6518677B1 | Semiconductor flip-chip package and method for the fabrication thereof | Electricity | 100 | Expired |
| US6440257B1 | Self-adhesive prepreg face sheets for sandwich panels | Emerging Cross-Sectional Technologies | 51 | Expired |
| US6774493B2 | Semiconductor flip-chip package and method for the fabrication thereof | Electricity | 37 | Expired |
| US6566234B1 | Semiconductor flip-chip package and method for the fabrication thereof | Electricity | 34 | Expired |
| US6508910B2 | Self-adhesive prepreg face sheet for sandwich panels | Emerging Cross-Sectional Technologies | 26 | Expired |
| US8975170B2 | Dopant ink compositions for forming doped regions in semiconductor substrates, and methods for fabricating dopant ink compositions | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.