Linghan Chen
2Patents
0h-index
3Co-inventors
21Inventor score
Filing activity: Aug 11, 2021 → May 9, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12412854B2 | Semiconductor devices containing copper bonding pads with different conductive barrier layers and methods for forming the same | Electricity | 0 | Active |
| US11990413B2 | Three-dimensional memory device including aluminum alloy word lines and method of making the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.