Lisa Yang
6Patents
5h-index
13Co-inventors
52Inventor score
Filing activity: Jun 5, 1998 → Mar 18, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6149784A | Sputtering chamber shield promoting reliable plasma ignition | Electricity | 36 | Expired |
| US6297147A | Plasma treatment for ex-situ contact fill | Electricity | 25 | Expired |
| US6426282B1 | Method of forming solder bumps on a semiconductor wafer | Electricity | 16 | Expired |
| USD436815S | Pivotal coupling for a shear device | General | 8 | Expired |
| US7321140B2 | Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier | Electricity | 7 | Expired |
| US7485556B2 | Forming metal silicide on silicon-containing features of a substrate | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.