Sputtering chamber shield promoting reliable plasma ignition
US6149784A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1999 |
| Grant date | Nov 21, 2000 |
| Priority date | — |
| Expiry date | Oct 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3402
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A shield for a DC magnetron sputtering reactor, particularly advantageous for reliably igniting the plasma used in sputtering a ferromagnetic material such as cobalt or nickel. The grounded shield includes a slanted portion separated from the beveled periphery of the target by a small gap operating as a dark space. The shield also includes a straight cylindrical portion surrounding the main processing area. The slanted portion is joined to the cylindrical portion at a knee According to one embodiment of the invention, the knee is located greater than 9 mm from the face of the target and at a radial position at least 1 mm inward of the outer periphery of the target face.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.