Lufeng Che
4Patents
0h-index
4Co-inventors
27Inventor score
Filing activity: Dec 3, 2012 → Jan 12, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9476906B2 | Capacitive acceleration sensor with an H-shaped beam and preparation method thereof | Physics | 0 | Active |
| US9625487B2 | Capacitive acceleration sensor with a bending elastic beam and preparation method thereof | Physics | 0 | Active |
| US9625488B2 | Variable area capacitive lateral acceleration sensor and preparation method thereof | Physics | 0 | Active |
| US11780727B2 | Low-stress packaging structure for MEMS acceleration sensor chip | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.