Mark A. DiRocco
4Patents
1h-index
9Co-inventors
30Inventor score
Filing activity: Feb 27, 2013 → Aug 20, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9269642B2 | Methods for testing integrated circuits of wafer and testing structures for integrated circuits | Electricity | 1 | Active |
| US9658255B2 | Signal monitoring of through-wafer vias using a multi-layer inductor | Electricity | 1 | Active |
| US8937010B2 | Information encoding using wirebonds | Electricity | 0 | Active |
| US9372208B2 | Signal monitoring of through-wafer vias using a multi-layer inductor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.